Constitutive and damage model for solders

V. Stolkarts, Brian Moran, L. M. Keer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

21 Scopus citations

Abstract

A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions.

Original languageEnglish (US)
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages379-385
Number of pages7
ISBN (Print)0780345266
DOIs
StatePublished - Jan 1 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: May 25 1998May 28 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Other

Other48th Electronic Components and Technology Conference, ECTC 1998
CountryUnited States
CitySeattle
Period05/25/9805/28/98

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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