Thin film interdigital sensors have been designed and fabricated. The sensors were fabricated using different substrates and using different fabrication technology. The initial design was fabricated on glass slide and fabricated using IDT (Intergrated Device Technology). The new sensors were fabricated on silicon/silicon dioxide wafer. All sensors were coated with APTES, a cross-linker bind to certain bio-molecules and then were immobilized with Polymyxin B, a specific bio-molecules that bind to endotoxin (Lipopolysaccharide, LPS). Sensors were tested for different concentrations of LPS. The impedance characteristics were presented using Impedance Spectroscopy method. A principle component analysis (PCA) was used for better data classification method. © 2011 IEEE.
|Original language||English (US)|
|Title of host publication||2011 Fifth International Conference on Sensing Technology|
|Publisher||Institute of Electrical and Electronics Engineers (IEEE)|
|Number of pages||6|
|State||Published - Nov 2011|