Challenges in barrier and seed layers characterization of Cu technology IC devices

Kun Li*, Eddie Er, Timothy Yeow, Dong Tang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Ta barrier and Cu seed layer characterization becomes extremely challenging with devices scaling down into the 130- and 90-nm regime. This paper aims at providing a feasible solution for this challenge from both sample preparation and transmission electron microscopy imaging perspectives. Different sample preparation and imaging techniques are compared here.

Original languageEnglish (US)
Article number1673721
Pages (from-to)283-287
Number of pages5
JournalIEEE Transactions on Device and Materials Reliability
Volume6
Issue number2
DOIs
StatePublished - Jun 1 2006

Keywords

  • Cylindrical effect
  • Integrated circuits (IC)
  • Sample preparations
  • Transmission electron microscopy (TEM)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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