Bottom-up nanoarchitecture of semiconductor nano-building blocks by controllable in situ SEM-FIB thermal soldering method

Xuan Zhang, Xiujun Zheng, Hong Zhang, Junli Zhang, Jiecai Fu, Qiang Zhang, Chaoyi Peng, Feiming Bai, Xixiang Zhang, Yong Peng

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together by a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can precisely remain in an optimal range to avoid a strong thermal diffusion.
Original languageEnglish (US)
Pages (from-to)8707-8713
Number of pages7
JournalJ. Mater. Chem. C
Volume5
Issue number34
DOIs
StatePublished - 2017

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