TY - GEN
T1 - Axially Modulated Clamped-Guided Arch Resonator for Memory and Logic Applications
AU - Hafiz, Md Abdullah Al
AU - Tella, Sherif Adekunle
AU - Alcheikh, Nouha
AU - Fariborzi, Hossein
AU - Younis, Mohammad I.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2017/11/3
Y1 - 2017/11/3
N2 - We experimentally demonstrate memory and logic devices based on an axially modulated clamped-guided arch resonator. The device are electrostatically actuated and capacitively sensed, while the resonance frequency modulation is achieved through an axial electrostatic force from the guided side of the clamped-guided arch microbeam. We present two case studies: first, a dynamic memory based on the nonlinear frequency response of the resonator, and second, a reprogrammable two-input logic gate based on the linear frequency modulation of the resonator. These devices show energy cost per memory/logic operation in pJ, are fully compatible with CMOS fabrication processes, have the potential for on-chip system integration, and operate at room temperature.
AB - We experimentally demonstrate memory and logic devices based on an axially modulated clamped-guided arch resonator. The device are electrostatically actuated and capacitively sensed, while the resonance frequency modulation is achieved through an axial electrostatic force from the guided side of the clamped-guided arch microbeam. We present two case studies: first, a dynamic memory based on the nonlinear frequency response of the resonator, and second, a reprogrammable two-input logic gate based on the linear frequency modulation of the resonator. These devices show energy cost per memory/logic operation in pJ, are fully compatible with CMOS fabrication processes, have the potential for on-chip system integration, and operate at room temperature.
UR - http://hdl.handle.net/10754/626779
UR - http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=2662164
UR - http://www.scopus.com/inward/record.url?scp=85034748448&partnerID=8YFLogxK
U2 - 10.1115/detc2017-68284
DO - 10.1115/detc2017-68284
M3 - Conference contribution
AN - SCOPUS:85034748448
SN - 9780791858165
BT - Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems
PB - ASME International
ER -