Automated assembly of hingeless 90° out-of-plane microstructures

S. H. Tsang*, D. Sameoto, Ian Grant Foulds, R. W. Johnstone, M. Parameswaran

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

A novel design for hingeless out-of-plane microstructures is presented. These structures can be assembled to 90° by a single-point actuation, which can be provided by, for example, a microelectronics wirebonder or a microprober station. Both wirebonders and microprober stations are commonly available to microfabrication facilities, and therefore the assembly method described here introduces a practical and economical approach to the creation of out-of-plane structures. The microstructure designs can be used in many types of microfabrication processes, and in particular have been fabricated using both PolyMUMPs and an SU-8 technology developed at Simon Fraser University. In addition to the fabricated devices, we will present the results of finite element analysis (FEA). Also reported here are tests for positional repeatability and reliability.

Original languageEnglish (US)
Article number014
Pages (from-to)1314-1325
Number of pages12
JournalJournal of Micromechanics and Microengineering
Volume17
Issue number7
DOIs
StatePublished - Jul 1 2007

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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