An investigation into the effect of the PCB motion on the dynamic response of MEMS devices under mechanical shock loads

Fadi Alsaleem*, Mohammad Younis, Ronald Miles

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting the PCB effect on the modeling of MEMS under shock loads can lead to erroneous predictions of the microstructure motion. Further, contradictory to what is mentioned in literature that a PCB, as a worst-case scenario, transfers the shock pulse to the microstructure without significantly altering its shape or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces.

Original languageEnglish (US)
Pages (from-to)310021-3100210
Number of pages2790190
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume130
Issue number3
DOIs
StatePublished - Sep 1 2008

Keywords

  • Electrostatic force
  • MEMS
  • PCB motion
  • Shock

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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