A well-conditioned integral-equation formulation for efficient transient analysis of electrically small microelectronic devices

Hakan Bagci, Francesco P. Andriulli, Francesca Vipiana, Giuseppe Vecchi, Eric Michielssen

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

A hierarchically regularized coupled set of time-domain surface and volume electric field integral-equations (TD-S-EFIE and TD-V-EFIE) for analyzing electromagnetic wave interactions with electrically small and geometrically intricate composite structures comprising perfect electrically conducting surfaces and finite dielectric volumes is presented. A classically formulated coupled set of TD-S- and V-EFIEs is shown to be ill-conditioned at low frequencies owing to the hypersingular nature of the TD-S-EFIE. To eliminate low-frequency breakdown in marching-on-in-time solvers for these coupled equations, a hierarchical regularizer leveraging generalized RaoWiltonGlisson functions is applied to the TD-S-EFIE; no regularization is applied to the TD-V-EFIE as it is protected from low-frequency breakdown by an identity term. The resulting hierarchically regularized hybrid TD-S- and V-EFIE solver is applicable to the analysis of wave interactions with electrically small and densely meshed structures of arbitrary topology. The accuracy, efficiency, and applicability of the proposed solver are demonstrated by analyzing crosstalk in a six-port transmission line, radiation from a miniature radio-frequency identification antenna, and, plane-wave coupling onto a partially-shielded and fully loaded two-layer computer board. © 2006 IEEE.
Original languageEnglish (US)
Pages (from-to)468-480
Number of pages13
JournalIEEE Transactions on Advanced Packaging
Volume33
Issue number2
DOIs
StatePublished - May 2010

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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