A study of sulphur assisted corrosion in technologies with copper interconnects

Nitin R. Kamat*, Manni Lal, Chong Khiam Oh, Kun Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish (US)
Title of host publicationProceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Pages183-186
Number of pages4
DOIs
StatePublished - 2006
Externally publishedYes
Event13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 - Singapore, Singapore
Duration: Jul 3 2006Jul 7 2006

Other

Other13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
CountrySingapore
CitySingapore
Period07/3/0607/7/06

ASJC Scopus subject areas

  • Engineering(all)

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