A Molecular-Scale Understanding of Cohesion and Fracture in P3HT:Fullerene Blends

Naga Rajesh Tummala, Christopher Bruner, Chad Risko, Jean-Luc Bredas, Reinhold H. Dauskardt

Research output: Contribution to journalArticlepeer-review

45 Scopus citations

Abstract

Quantifying cohesion and understanding fracture phenomena in thin-film electronic devices are necessary for improved materials design and processing criteria. For organic photovoltaics (OPVs), the cohesion of the photoactive layer portends its mechanical flexibility, reliability, and lifetime. Here, the molecular mechanism for the initiation of cohesive failure in bulk heterojunction (BHJ) OPV active layers derived from the semiconducting polymer poly-(3-hexylthiophene) [P3HT] and two mono-substituted fullerenes is examined experimentally and through molecular-dynamics simulations. The results detail how, under identical conditions, cohesion significantly changes due to minor variations in the fullerene adduct functionality, an important materials consideration that needs to be taken into account across fields where soluble fullerene derivatives are used.
Original languageEnglish (US)
Pages (from-to)9957-9964
Number of pages8
JournalACS Applied Materials & Interfaces
Volume7
Issue number18
DOIs
StatePublished - Apr 30 2015

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