A model for thermoelastic damping in microplates

Ali H. Nayfeh*, Mohammad I. Younis

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

We present a model and analytical expressions for the quality factors of microplates due to thermoelastic damping. We solve the heat equation for the thermal current across the thickness of a microplate, and hence decouple the thermal equation from the plate equation. We utilize a perturbation method to derive an analytical expression for the quality factor of microplates, of general boundary conditions under electrostatic loading and residual stresses, in terms of their structural mode shapes. For the special case of no electrostatic and in-plane loadings, we derive a simple analytical expression for the quality factor, which is independent of the mode shapes. We verify the model by comparing the calculated quality factors of the special case of microbeams to theoretical results obtained using the microbeam models in the literature. We present several results for various modes of microplates with various boundary conditions.

Original languageEnglish (US)
Title of host publication2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
EditorsM. Laudon, B. Romanowicz
Pages255-258
Number of pages4
Volume2
StatePublished - 2004
Externally publishedYes
Event2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004 - Boston, MA, United States
Duration: Mar 7 2004Mar 11 2004

Other

Other2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004
CountryUnited States
CityBoston, MA
Period03/7/0403/11/04

Keywords

  • Electrostatic forces
  • Microplates
  • Quality factors
  • Thermoelastic damping

ASJC Scopus subject areas

  • Engineering(all)

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