A 2-layer resist system derived from trimethylsilylstyrene

S. A. Macdonald, R. D. Allen, N. J. Clecak, C. G. Willson, J. M.J. Frechet

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

This paper describes the design and preparation of a negative tone, oxygen etch resistant DUV photoresist. This two-component resist system is composed of an oxygen plasma etch resistant matrix resin, poly(trimethylsilylmethylstyrene), and a monomeric radical generator such as trichlorobenzene or 3, 3’-diazidodiphenylsulfone.

Original languageEnglish (US)
Pages (from-to)28-33
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume631
DOIs
StatePublished - Jul 9 1986
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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