3D lumped components and miniaturized bandpass filter in an ultra-thin M-LCP for SOP applications

Eyad A. Arabi, Atif Shamim

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

In this work, a library of 3D lumped components completely embedded in the thinnest, multilayer LCP (M-LCP) stack- up with four metallization layers and 100 μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional parallel plate capacitor. Based on the above mentioned library, a miniaturized bandpass filter is presented for the GPS application. It utilizes mutually coupled inductors and is the smallest reported in the literature with a size of (0.035×0.028×0.00089)λg. Finally, the same filter realized in a competing ceramic technology (LTCC) is compared in performance with the ultra-thin M-LCP design. The M-LCP module presented in this work is inherently exible and offers great potential for wearable and conformal applications.
Original languageEnglish (US)
Pages (from-to)197-210
Number of pages14
JournalProgress In Electromagnetics Research C
Volume44
DOIs
StatePublished - 2013

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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