3D Coin Integration for Realizing Next-Generation Flexible Electronic Systems

Sohail F. Shaikh, Nadeem Qaiser, Muhammad Mustafa Hussain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present CMOS-compatible 3D coin architecture interconnect technology for enabling manufacturable heterogeneously integrated physically compliant electronic systems (< 1 mm bending radius). The interconnect technology along with the integration scheme shall maximize the area efficiency by having sensors on one side of the soft-polymeric platform (one side of coin) and other data processing, storage, and energy (solid-state battery) sandwiched within the polymeric encapsulation. Other side of the coin is used for RF/communication and energy harvesting module. Such an architecture will be an enabling factor in realization of truly flexible electronic platforms for IoT and implantable applications of next generation.
Original languageEnglish (US)
Title of host publication2020 IEEE International Interconnect Technology Conference (IITC)
PublisherIEEE
ISBN (Print)978-1-7281-6114-3
DOIs
StatePublished - 2020

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