Wafer bonding system

    Gheorghe Iordache (Manager)

Equipment/facility: Equipment

  • Location

    King Abdullah University of Science and Technology Thuwal 23955

    Saudi Arabia

Equipments Details

Description

Instrument to perform bonding and hot embossing on a wafer. 
Model: 520IS
Photo associated with equipment

Details

NameWafer bonding system
Acquisition date04/1/10
ManufacturersEV Group (EVG)

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